A. S. M. A. Haseeb

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Recently one dimensional (1-D) nanostructured metal-oxides have attracted much attention because of their potential applications in gas sensors. 1-D nanostructured metal-oxides provide high surface to volume ratio, while maintaining good chemical and thermal stabilities with minimal power consumption and low weight. In recent years, various processing(More)
Several candidate alloys have been suggested as high-temperature lead-free solder for Si die attachment by different researchers. Among them, Zn–Al based alloys have proper melting range and excellent thermal/electrical properties. In this study, Zn–Al–Mg–Ga solder wire was used to attach Ti/Ni/Ag metallized Si die on Cu lead-frame in an automatic die(More)
RoHS Directive for environmental and health concerns have resulted in significant activities to find substitutes for lead-contained solders for microelectronics. The potential candidates such as Sn-Ag1 and Sn-Ag-Cu1 eutectic solders with melting temperatures of 221degC and 217degC, respectively are the most prominent solders because of their excellent(More)
An inexpensive single-step carbon-assisted thermal evaporation method for the growth of SnO2-core/ZnO-shell nanostructures is described, and the ethanol sensing properties are presented. The structure and phases of the grown nanostructures are investigated by field-emission scanning electron microscopy (FESEM), transmission electron microscopy (TEM) and(More)
In this investigation, anatase TiO2 thin films were grown by radio frequency magnetron sputtering on glass substrates at a high sputtering pressure and room temperature. The anatase films were then annealed at 300-600 °C in air for a period of 1 hour. To examine the structure and morphology of the films, X-ray diffraction (XRD) and atomic force microscopy(More)
One of the fundamental requirements for high-temperature electronic packaging is reliable silicon attach with low and stable electrical resistance. This paper presents a study conducted on Cu nanoparticles as an alternative lead-free interconnect material for high-temperature applications. Cu nanoparticles were prepared using pulsed wire evaporation(More)
Zn-Al based alloys have been suggested as high temperature lead-free solder for Si die attach by different researchers. But, so far, these alloys have not been tested in the industrial environment. In this study, Zn-Al-Ge alloy solder wire was used for Si die attachment on Cu substrate in an automatic die attach machine. The back side of the die was(More)
In this research work, the sensitivity of TiO2 nanoparticles towards C2H5OH, H2 and CH4 gases was investigated. The morphology and phase content of the particles was preserved during sensing tests by prior heat treatment of the samples at temperatures as high as 750 °C and 1000 °C. Field emission scanning electron microscopy (FESEM), transmission electron(More)
Eutectic Sn-Bi alloy is gaining considerable attention in the electronic packaging applications. This alloy exhibits favorable properties such as low melting temperature, good wettability, high yield strength and fracture strength at room temperature. Miniaturization of electronic devices limited the choices of deposition technique where electrodeposition(More)