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A method for detecting a thickness of a layer of a wafer is provided. The method includes defining a particular radius of a wafer carrier configured to engage the wafer to be processed. The method… Continue Reading
A system and method for measuring a metal layer on the substrate in a multi-step process, the substrate includes the step of deforming the metallic layer on the substrate such as to remove at least a… Continue Reading
An apparatus and method are provided for improving the properties measured based on the resistance of the substrate. The apparatus includes a sensor configured to detect the signal generated by the… Continue Reading