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Sn2.4Ag覆晶銲錫接點之介金屬化合物之電/熱遷移現象研究
- 王偉傑
- Materials Science
- 2012
The present study investigated the effect of electromigration and thermomigration on the evolution of intermetallic compounds (IMCs) in the flip chip Cu/Sn2.4Ag/Cu solder joints. In this study, two… Expand