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The present invention relates to a method of manufacturing an electronic module comprising a component (6), the electronic module has a contact region (7) which is electrically connected to the… (More)
This application is intended to disclose a method for manufacturing a circuit board structure. According to the method, to prepare a conductor pattern (13), making contact openings in the conductor… (More)
This publication discloses an electronics module and a method for manufacturing it. The electronic module includes at least one first embedded component (6), the contact terminals (7) of which face… (More)
This application is intended to disclose a method for manufacturing a circuit board structure. In the method, producing the conductor foil (2), on the surface of the conductor foil conductor layer… (More)